imrishabh18/pedometer

This code defines and assembles a simple radio receiver hardware circuit using specific imported capacitors, inductors, RF connectors, and oscillator components with precise footprints and schematic attributes.

Version
1.1.3
License
unset
Stars
0

README.md

> Version 1.1.3 corrects the 12 passive footprints rejected by JLCPCB and four related passives. Use the new Gerbers, BOM and CPL together. See [footprint correction](docs/footprint-correction.md) and the supplied fabrication package.

# Stride — CC2340R5 Bluetooth pedometer

Rev B is a 40 × 38 mm, four-layer PCB using the **bare CC2340R52E0RGER**, **BQ25150YFPR**, **BQ27427YZFR**, BMA400 step counter, a separate ceramic antenna, USB-C power input and an external I²C OLED.

**BGA via-in-pad is allowed.** The tscircuit fanout solver plans the enclosed BGA terminals, and the capacity autorouter routes the board. There are no explicit `<via />` elements. RF, crystal and SWCLK nets use Pipeline 9 first; the remaining nets use Pipeline 7. Physical through-via clearance is checked on all copper layers.

Current checks and fabrication conditions are recorded in [fabrication review](docs/fabrication-review.md). Use the generated **CAM review package**, including its assembly instructions, for manufacturer review. Filled/capped vias, BGA mask registration, stencil and RF stackup require factory acceptance before ordering.

## Build and check

Dependencies are pinned: tscircuit 0.0.2463, capacity-autorouter 0.0.875, fanout-solver 0.0.57 and circuit-json-to-gerber 0.0.104 (unpatched).

```sh
bun install --frozen-lockfile
bun run dev
bun run build
bun run typecheck
bun run check:tsci
bun run check:shorts
bun run check
bun run check:programming
bun run export:manufacturing
bun run audit:manufacturing
bun run audit:footprints
bun run test:manufacturing
bun run test:radio
bun run test:usb
bun run audit:bga-vias
bun run review
bun run audit:passive-gerbers
```

The CLI build can exit zero with embedded DRC errors, so `check` independently reruns routing checks. `audit:bga-vias` reports permitted via-in-pad locations. The optional `check:no-via-in-pad` tests the former, stricter policy and is not a release requirement. `check:fabrication` additionally requires the hash-bound factory/process review to be cleared; it must not be bypassed to place an order.

Use `export:manufacturing` for Gerbers: it prepares the TI BGA/QFN stencil apertures, BGA mask openings and printable underside legend. Browser exports do not apply this preparation. Copper and generated drill locations are unchanged by manufacturing preparation.

## Programming and parts

J4 exposes 2.5 V VTREF, SWDIO, SWCLK, ground and reset. [Programming instructions](docs/programming.md) include the exact connector-to-MCU map and routed continuity check. USB-C is power/charging only. A compatible SWD probe and adapter cable are required.

All **62 PCB components** have exact MPNs and JLCPCB codes. Stock was not rechecked for this revision. See [PCB-only BOM](review/jlc-bom.csv). The battery, its NTC, display and external cables are separate procurement items. The nominal protected 100 mAh cell and weeks-of-runtime estimate remain unmeasured assumptions.

The portable C pedometer core and host tests are provided. TI SDK board drivers, GATT and NVS integration are still required for a complete flashable application. No hardware programming, radio-range or charging test has been performed on a physical board.

## Design files

- [PCB preview](review/pcb.svg) and [five schematic sheets](review/schematic.svg); the schematic uses five A4 sheets and fifteen sections.
- [Power and charging](review/schematic-1-power.svg), [logic](review/schematic-2-logic.svg), [display](review/schematic-3-display.svg), [USB-C](review/schematic-4-usb.svg), [bare MCU and RF](review/schematic-5-radio.svg).
- `index.circuit.tsx`, `schematic-layout.tsx`, `net-map.ts`, `pin-specs.ts`, `imports/`: editable design and pin mappings.
- `bga-fanout.ts`, `bga-autorouter.ts`, `through-via-drc.ts`, `via-clearance.ts`: automatic routing and geometry correction.
- [Assembly process](docs/assembly-requirements.md), [bare MCU/RF](docs/bare-cc2340r5.md), [interfaces](docs/interfaces.md), [power budget](docs/power-budget.md), [firmware integration](docs/firmware-and-bringup.md).

Historical module-revision renders and exporter comparisons in `review/` do not represent the current board. The previous published revision may differ from this local source.